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PLATING NIR-ELEKTRIK TEMBAGA DENGAN MENGGUNAKAN DIMETIL AMINA BORANA (DMAB) SEBAGAI REDUKTOR

Emriadi, Emriadi (2010) PLATING NIR-ELEKTRIK TEMBAGA DENGAN MENGGUNAKAN DIMETIL AMINA BORANA (DMAB) SEBAGAI REDUKTOR. Jurnal Kimia Andalas, 3 (1). ISSN 0853-8018

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Abstract

It has been investigated on electroless plating copper with dirnetil amine borane (DMAB) as reduction agent. The rate of deposition was determined by weight gain and for the mix potential measurement saturated calomel electrode was used. An electrolyte composition has been developed, and the deposition parameters have been optimized.

Item Type: Article
Subjects: Q Science > QD Chemistry
Unit atau Lembaga: Fakultas MIPA > Kimia
Paca Sarjana > Doktor > Fakultas MIPA > Kimia
Fakultas MIPA > Kimia
Depositing User: dody ichwana
Date Deposited: 23 Jul 2010 04:59
Last Modified: 22 Sep 2011 04:37
URI: http://repository.unand.ac.id/id/eprint/3748

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