Emriadi, Emriadi (2010) PLATING NIR-ELEKTRIK TEMBAGA DENGAN MENGGUNAKAN DIMETIL AMINA BORANA (DMAB) SEBAGAI REDUKTOR. Jurnal Kimia Andalas, 3 (1). ISSN 0853-8018
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Abstract
It has been investigated on electroless plating copper with dirnetil amine borane (DMAB) as reduction agent. The rate of deposition was determined by weight gain and for the mix potential measurement saturated calomel electrode was used. An electrolyte composition has been developed, and the deposition parameters have been optimized.
| Item Type: | Article |
|---|---|
| Subjects: | Q Science > QD Chemistry |
| Unit atau Lembaga: | Fakultas MIPA > Kimia Paca Sarjana > Doktor > Fakultas MIPA > Kimia Fakultas MIPA > Kimia |
| Depositing User: | dody ichwana |
| Date Deposited: | 23 Jul 2010 04:59 |
| Last Modified: | 22 Sep 2011 04:37 |
| URI: | http://repository.unand.ac.id/id/eprint/3748 |
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